Due to problems such as undercutting, the etching method has limitations in the processing of fine circuits.īased on the processing difficulties of the subtractive method or the difficulty in maintaining high-yield microcircuits, the semi-additive method is considered to be an effective method, and various semi-additive methods have been proposed.
Usually, a copper-clad board is used as a starting material, a resist layer is formed by photolithography, and the unnecessary part of the copper surface is etched and removed to form a circuit conductor. There is also a production process, which is rarely used in the industry at present because fine circuits cannot be done, and it is only suitable for single-panel manufacturing.Įngineering documents → film → making screen → copper foil → etching ink printing → UV drying → etching → removing film → solder mask printing → electroplating nickel gold → punching → inspection → shipment.Īlmost all the FPC manufacturing processes so far have been processed by the subtractive method (etching method). Cutting → drilling → sticking dry film → alignment → exposure → developing → etching → stripping → surface treatment → covering film → pressing → curing → surface treatment → immersion of nickel and gold → printing characters → cutting → electrical measurement → punching Cutting → final inspection → packaging → shipping.
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